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공동협력체구축
Artificial Intelligence
반도체 첨단 패키징 R&D 위한 민관 공동협력체 구축
산업통상자원부(장관 이창양)는 민관 협력 반도체 첨단 패키징 기술개발을 위해 MOU를 체결했다고 29일 밝혔다. 서울 엘타워에서 열린 업무 협약식에는 반도체 기업, 소부장, 반도체 후공정 전문업체(OSAT) 및 팹리스 기업 등이 참여해 '반도체 첨단 패키징 기술개발 협력에 관한 협약'을...
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September 5, 2023
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