News has been reported that Samsung Electronics has passed Nvidia’s test with its fifth generation high bandwidth memory (HBM) ‘HBM3E (8-layer)’.
Citing three anonymous sources, Reuters reported on the seventh that Samsung had passed quality tests to produce HBM3E to Nvidia.
In response to this, Samsung Electronics is anticipated to sign a supply contract with Nvidia soon and plans to begin supplying products within the fourth quarter.
Nevertheless, it is understood that the HBM3E 12-layer product has not yet passed the test.
Nvidia and Samsung have yet to make an official comment.
In relation to this, in May, it was reported that Samsung had failed Nvidia’s test resulting from heat and power issues. Samsung refuted this, however it is understood that it had reworked the HBM3E design.
Reuters also reported on the twenty fourth of last month that the 4th generation HBM3 chip had first been approved by Nvidia to be used in processors.
Nevertheless, it has been reported that Samsung’s HBM3, which passed the test on the time, will only be utilized in the GPU ‘H20’ made by Nvidia for export to China in the interim.
Meanwhile, on that day, news was also reported that Chinese firms had began stockpiling Samsung’s HBM consistent with the US’ policy of strengthening export regulations.
Chinese cloud firms comparable to Huawei and Baidu are said to have stockpiled supplies ahead of the U.S. government’s export restrictions, expanding Samsung’s chip market share in China to 30%.
In response to a Bloomberg report on the thirty first of last month, the U.S. government is reportedly considering adding Samsung, SK Hynix, and Micron to the sanctions list to forestall them from supplying HBM, which is utilized in artificial intelligence (AI) development, to China.
The measure is anticipated to be announced as early as August.
Reporter Jang Se-min semim99@aitimes.com
